BA 8110ESD is manufactured from ESD Polyimide film with a high-temperature silicone adhesive. It is constructed to fill the requirements of a high-performance Thermoplastic (Polyimide Backing Materials). BA 8110ESD is material of choice for gold finger protection during wave solder applications that require reduced electrostatic discharge upon tape removal. BA8110ESD exhibits high tensile strength and conformability, as well as good solvent resistance, excellent dielectric strength and good abrasion resistance.
BA 8110ESD TDS
BA 8550 is manufactured from 2.0 high modulus coated with 1.5 mil pressure sensitive rubber adhesive. Excellent conformability and release properties of the PTFE backing make BA 8850 ideal for applications such as composite lay-up, roller wrapping, plate masking, heat sealing and other uses where costly clean up is a problem.The aerospace industry uses it in phase insulation for bundling end turns, spot bundling, anchor breakouts and to protect airframe wire harnesses.
BA 8850 TDS