BA 8110ESD is manufactured from ESD Polyimide film with a high-temperature silicone adhesive. It is constructed to fill the requirements of a high-performance Thermoplastic (Polyimide Backing Materials). BA 8110ESD is material of choice for gold finger protection during wave solder applications that require reduced electrostatic discharge upon tape removal. BA8110ESD exhibits high tensile strength and conformability, as well as good solvent resistance, excellent dielectric strength and good abrasion resistance.
BA 8110ESD
ESD Polyimide Film
Description
BA 8110ESD is manufactured from ESD Polyimide film with a high-temperature silicone adhesive. It is constructed to fill the requirements of a high-performance Thermoplastic (Polyimide Backing Materials). BA 8110ESD is material of choice for gold finger protection during wave solder applications that require reduced electrostatic discharge upon tape removal. BA8110ESD exhibits high tensile strength and conformability, as well as good solvent resistance, excellent dielectric strength and good abrasion resistance.
BA 8110ESD TDS
Additional information
Silicone
Gold Finger Protection During Wave Soldering
Amber
Electronics, Gold Finger Masking
Wave Soldering
Polyimide
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