MAPSIL® 213-BSP Coating
- Type Coating
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Low outgassing self priming encapsulating resin
MAPSIL® 213-BSP is a low outgassing two component silicone resin used as an encapsulating, adhesive or varnish for printed circuits boards (PCB). MAPSIL® 213-BSP is a RTV-2 silicone adhesive elastomer dedicated to encapsulate electronic components used in the space industry & vacuum technologies. It can be used as an adhesive for solar cells or as varnish for PCB.
Developed from MAPSIL® 213-B, MAPSIL® 213-BSP holds a specific silane which improves adhesion on several substrates. Using MAPSIL® 213-BSP does not require adhesion primer such as PSX to improve adhesion.
Applications:
MAPSIL® 213-BSP is suitable for several applications:
encapsulating, bonding or varnishing. MAPSIL. 213-BSP can be applied by pouring (encapsulating), with a spatula (bonding) or with a brush (varnishing).