MAPSIL® 213 Coating
- Type Coating
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Low outgassing encapsulating resin
MAPSIL® 213 is a low outgassing two component silicone resin used as an encapsulating, adhesive or varnish for printed circuits boards (PCB).
MAPSIL® 213 is a RTV-2 silicone adhesive elastomer dedicated to encapsulate electronic components used in the space industry & vacuum technologies. Used as an adhesive for solar cells or as varnish for PCB.
In case of low thickness applications, MAPSIL. 213-B may be used (see technical data sheet RE2132). Please contact us for further characterizations and uses (see page 2 – “Substrates and adhesion”)
Applications:
MAPSIL® 213 is suitable for several applications:
Encapsulating, bonding or varnishing.
MAPSIL® 213 can be applied by pouring (encapsulating), with a spatula (bonding) or with a brush (varnishing).